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| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Packaging | Color | Number of Positions | Pitch | Number of Rows | Contact Material | Gender | Mounting Type | Contact Type | Card Type | Features | Termination | Operating Temperature | Part Status | Contact Finish | Contact Finish Thickness | Number of Positions/Bay/Row | Card Thickness | Read Out | Flange Feature | |
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Samtec Inc. | CONN EDGEDUAL FMALE 60POS 0.039 | MEC1 | Tube | Black | 60 | 0.039" (1.00mm) | 2 | Beryllium Copper | Female | Surface Mount | Loop Bellows | Non Specified - Dual Edge | Board Lock | Solder | -55°C ~ 125°C | Active | Gold | 10.0µin (0.25µm) | - | 0.062" (1.57mm) | Dual | - | ||||
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Samtec Inc. | CONN EDGE DUAL FMALE 10POS 0.039 | MEC1 | Tube | Black | 0.039" (1.00mm) | Beryllium Copper | Female | Surface Mount | Loop Bellows | Non Specified - Dual Edge | Pick and Place | Solder | -55°C ~ 125°C | Active | Gold | 3.00µin (0.076µm) | - | 0.062" (1.57mm) | Dual | - | ||||||
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Samtec Inc. | 1MM MINI-EDGE CARD ASSEMBLY | MEC1 | Tube | Black | 40 | 0.039" (1.00mm) | 2 | Phosphor Bronze | Female | Surface Mount | Loop Bellows | Non Specified - Dual Edge | Board Guide | Solder | -55°C ~ 125°C | Active | Gold | 3.00µin (0.076µm) | 20 | 0.062" (1.57mm) | Dual | - | ||||
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Samtec Inc. | .8MM HIGH SPEED DUAL VERTICAL MO | Edge Rate™ HSEC8 | Black | 0.031" (0.80mm) | Beryllium Copper | Female | Surface Mount | Cantilever | Non Specified - Dual Edge | Board Guide, Locking Ramp | Solder | -55°C ~ 125°C | Active | Gold | 30.0µin (0.76µm) | 0.093" (2.36mm) | Dual | - |