- INL/DNL (LSB) :
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| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Packaging | Number of Bits | Architecture | Reference Type | Settling Time | Output Type | Mounting Type | Operating Temperature | Part Status | Supplier Device Package | Data Interface | Voltage - Supply, Analog | Number of D/A Converters | Differential Output | INL/DNL (LSB) | |
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Microchip Technology | I2C DUAL CHANNEL 12-BIT | 10-VFDFN Exposed Pad | - | Current Source | External, Internal | 16µs (Typ) | Voltage - Buffered | Surface Mount | -40°C ~ 125°C | Active | 10-DFN (3x3) | I²C | 1.8 V ~ 5.5 V | No | ±1, ±1 | ||||||
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Microchip Technology | I2C DUAL CHANNEL 10-BIT | 10-VFDFN Exposed Pad | - | Current Source | External, Internal | 16µs (Typ) | Voltage - Buffered | Surface Mount | -40°C ~ 125°C | Active | 10-DFN (3x3) | I²C | 1.8 V ~ 5.5 V | No | ±0.25, ±0.25 | ||||||
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Microchip Technology | I2C DUAL CHANNEL 10-BIT VOLATILE | 10-VFDFN Exposed Pad | - | Current Source | External, Internal | 16µs (Typ) | Voltage - Buffered | Surface Mount | -40°C ~ 125°C | Active | 10-DFN (3x3) | I²C | 1.8 V ~ 5.5 V | No | ±0.25, ±0.25 | ||||||
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Microchip Technology | I2C SINGLE CHANNEL 12-BIT VOLATI | 10-VFDFN Exposed Pad | - | Current Source | External, Internal | 16µs (Typ) | Voltage - Buffered | Surface Mount | -40°C ~ 125°C | Active | 10-DFN (3x3) | I²C | 1.8 V ~ 5.5 V | No | ±1, ±1 | ||||||
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Microchip Technology | I2C DUAL CHANNEL 8-BIT | 10-VFDFN Exposed Pad | - | Current Source | External, Internal | 16µs (Typ) | Voltage - Buffered | Surface Mount | -40°C ~ 125°C | Active | 10-DFN (3x3) | I²C | 1.8 V ~ 5.5 V | No | ±0.1, ±0.1 | ||||||
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Microchip Technology | I2C DUAL CHANNEL 8-BIT VOLATILE | 10-VFDFN Exposed Pad | Tube | Current Source | External, Internal | 16µs (Typ) | Voltage - Buffered | Surface Mount | -40°C ~ 125°C | Active | 10-DFN (3x3) | I²C | 1.8 V ~ 5.5 V | No | ±0.1, ±0.1 | ||||||
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Microchip Technology | I2C SINGLE CHANNEL 10-BIT | 10-VFDFN Exposed Pad | - | Current Source | External, Internal | 16µs (Typ) | Voltage - Buffered | Surface Mount | -40°C ~ 125°C | Active | 10-DFN (3x3) | I²C | 1.8 V ~ 5.5 V | No | ±0.25, ±0.25 | ||||||
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Microchip Technology | I2C SINGLE CHANNEL 10-BIT VOLATI | 10-VFDFN Exposed Pad | - | Current Source | External, Internal | 16µs (Typ) | Voltage - Buffered | Surface Mount | -40°C ~ 125°C | Active | 10-DFN (3x3) | I²C | 1.8 V ~ 5.5 V | No | ±0.25, ±0.25 | ||||||
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Microchip Technology | I2C SINGLE CHANNEL 8-BIT | 10-VFDFN Exposed Pad | - | Current Source | External, Internal | 16µs (Typ) | Voltage - Buffered | Surface Mount | -40°C ~ 125°C | Active | 10-DFN (3x3) | I²C | 1.8 V ~ 5.5 V | No | ±0.1, ±0.1 | ||||||
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Microchip Technology | I2C SINGLE CHANNEL 8-BIT VOLATIL | 10-VFDFN Exposed Pad | - | Current Source | External, Internal | 16µs (Typ) | Voltage - Buffered | Surface Mount | -40°C ~ 125°C | Active | 10-DFN (3x3) | I²C | 1.8 V ~ 5.5 V | No | ±0.1, ±0.1 | ||||||
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Microchip Technology | I2C DUAL CHANNEL 12-BIT VOLATILE | 10-VFDFN Exposed Pad | Tube | Current Source | External, Internal | 16µs (Typ) | Voltage - Buffered | Surface Mount | -40°C ~ 125°C | Active | 10-DFN (3x3) | I²C | 1.8 V ~ 5.5 V | No | ±1, ±1 | ||||||
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Microchip Technology | I2C SINGLE CHANNEL 12-BIT | 10-VFDFN Exposed Pad | - | Current Source | External, Internal | 16µs (Typ) | Voltage - Buffered | Surface Mount | -40°C ~ 125°C | Active | 10-DFN (3x3) | I²C | 1.8 V ~ 5.5 V | No | ±1, ±1 |