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| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Mounting Type | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Applications | Current - Supply | Factory Stock | Minimum Quantity | |
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP LINEAR 0.5A V | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP LINEAR 0.5A V | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP LINEAR 0.5A V | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
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NXP USA Inc. | SYSTEM BASIS CHIP LINEAR 0.5A V | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
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NXP USA Inc. | SYSTEM BASIS CHIP LINEAR 0.5A V | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 |