- Package / Case :
-
- 100-LQFP (7)
- 128-LQFP Exposed Pad (1)
- 1292-BGA, FCBGA (5)
- 144-BGA (1)
- 16-LSOP (0.173", 4.40mm Width) (1)
- 16-LSSOP (0.173", 4.40mm Width) (2)
- 18-SOIC (0.213", 5.40mm Width) (1)
- 196-BGA (2)
- 24-SOP (0.213", 5.40mm Width) + 2 Heat Tabs (1)
- 256-BGA (5)
- 28-VFQFN (1)
- 32-TQFP (2)
- 324-FBGA (2)
- 36-VFQFN (1)
- 38-TFSOP (0.173", 4.40mm Width) (12)
- 38-VFQFN Exposed Pad (26)
- 42-WFQFN Exposed Pad (11)
- 48-VFQFN Exposed Pad (8)
- 672-BGA, FCBGA (3)
- 676-BGA (1)
- 8-DIP (0.300", 7.62mm) (1)
- 8-SOIC (0.173", 4.40mm Width) (2)
- 896-BGA (2)
- Packaging :
- Function :
-
- Bit Error Rate Tester (BERT) (2)
- Channel Extender (1)
- Ethernet Switch (6)
- Ethernet, SONET/SDH (2)
- Framer (2)
- Line Interface Unit (LIU) (2)
- Melody LSI (1)
- Receiver, DTMF (3)
- Single-Chip Transceiver (2)
- SONET/SDH (10)
- Sound Generator (2)
- Speech Network IC (1)
- Subscriber Line Interface Concept (SLIC) (8)
- Subscriber Line Interface Concept (SLIC), CODEC (51)
- TDM-over-Packet (TDMoP) (1)
- Tone Decoder (1)
- Tone Generator (2)
- Transceiver (9)
- Mounting Type :
- Operating Temperature :
- Voltage - Supply :
- Supplier Device Package :
-
- 100-LQFP (14x14) (6)
- 100-LQFP (16x16) (1)
- 128-LQFP (14x14) (1)
- 1292-FCBGA (5)
- 144-TEPBGA (17x17) (1)
- 16-SSOPA (1)
- 16-SSOPB (2)
- 18-SOP (1)
- 196-CABGA (15x15) (2)
- 24-HSOP (1)
- 256-BGA (27x27) (4)
- 256-CABGA (17x17) (1)
- 28-VQFN (1)
- 284-TQFP (24x24) (1)
- 302-TQFP (24x24) (6)
- 32-TQFP (7x7) (2)
- 324-PBGA (23x23) (2)
- 36-VQFN (6x6) (1)
- 38-QFN (5x7) (26)
- 38-TSSOP (12)
- 42-QFN (5x7) (11)
- 48-QFN (7x7) (8)
- 50-QFN (6x8) (2)
- 672-FCBGA (27x27) (3)
- 676-TEPBGA (27x27) (1)
- 8-DIP (1)
- 8-SOP (2)
- 896-FCBGA (2)
- Applied Filters :
15 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Number of Circuits | Function | Mounting Type | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Interface | Current - Supply | Power (Watts) | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microsemi Corporation | ARROW-2X192 | 1292-BGA, FCBGA | - | - | - | SONET/SDH | Surface Mount | - | Not For New Designs | 1.2V | 1292-FCBGA | SFI-4 | - | - | |||||
|
Microsemi Corporation | WSE-40, LF BUMP | 672-BGA, FCBGA | - | - | - | SONET/SDH | Surface Mount | - | Not For New Designs | 1.2V | 672-FCBGA (27x27) | Serial | - | - | |||||
|
Microsemi Corporation | TSE-240 | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | ARROW-2X192 | 1292-BGA, FCBGA | - | - | - | SONET/SDH | Surface Mount | - | Not For New Designs | 1.2V | 1292-FCBGA | SFI-4 | - | - | |||||
|
Microsemi Corporation | WSE-40 (PB FREE) | 672-BGA, FCBGA | - | - | - | SONET/SDH | Surface Mount | - | Not For New Designs | 1.2V | 672-FCBGA (27x27) | Serial | - | - | |||||
|
Microsemi Corporation | ARROW-1X192 | 1292-BGA, FCBGA | - | - | - | SONET/SDH | Surface Mount | - | Not For New Designs | 1.2V | 1292-FCBGA | SFI-4 | - | - | |||||
|
Microsemi Corporation | SONET/SDH TRANSPORT FRAMER/AGGRE | 1292-BGA, FCBGA | - | - | - | SONET/SDH | Surface Mount | - | Not For New Designs | 1.2V | 1292-FCBGA | SFI-4 | - | - | |||||
|
Microsemi Corporation | WSE-20 | 672-BGA, FCBGA | - | - | SONET/SDH | Surface Mount | - | Not For New Designs | - | 672-FCBGA (27x27) | Serial | - | - | ||||||
|
Microsemi Corporation | TSE-NX160 | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | TSE-240 (PB FREE) | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | TSE-120 | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | PM5324: ARROW-1X192 | 1292-BGA, FCBGA | - | - | - | SONET/SDH | Surface Mount | - | Not For New Designs | 1.2V | 1292-FCBGA | SFI-4 | - | - | |||||
|
Microsemi Corporation | TSE-120 (PB FREE) | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | TEMUX 168 PB FREE | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | ARROW 24XFE | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | 84/63 CHANNEL T1/E1 FRAMER DEVIC | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | 84/63 CHANNEL T1/E1 FRAMER DEVIC | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | ARROW 2XGE | 896-BGA | - | - | Ethernet, SONET/SDH | Surface Mount | -40°C ~ 85°C | Not For New Designs | 1.8V | 896-FCBGA | GMII, SerDes | - | - | ||||||
|
Microsemi Corporation | ARROW 2XGE PB FREE | 896-BGA | - | - | Ethernet, SONET/SDH | Surface Mount | -40°C ~ 85°C | Not For New Designs | 1.8V | 896-FCBGA | GMII, SerDes | - | - | ||||||
|
Microsemi Corporation | TEMUX-84 WITH E3 MAPPERS, DS3/E3 | 324-FBGA | - | - | - | Framer | Surface Mount | -40°C ~ 85°C | Not For New Designs | 1.8V, 3.3V | 324-PBGA (23x23) | E1, J1, T1 | - | - | |||||
|
Microsemi Corporation | TEMUX-84 WITH E3 MAPPERS, DS3/E3 | 324-FBGA | - | - | - | Framer | Surface Mount | -40°C ~ 85°C | Not For New Designs | 1.8V, 3.3V | 324-PBGA (23x23) | E1, J1, T1 | - | - | |||||
|
Microsemi Corporation | ARROW 24XFE PB FREE | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | TEMAP 84FDL, LF BUMP | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microchip Technology | DUAL/QUAD 10GBE UNIV PHY W/OTN-F | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | HIGH DENSITY FRAMER/MAPPER FOR 8 | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | ARROW M8XFE | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Maxim Integrated | IC TDM PACKET 32PORT 676PBGA | 676-BGA | - | Tray | TDM-over-Packet (TDMoP) | Surface Mount | -40°C ~ 85°C | Not For New Designs | 1.8V, 3.3V | 676-TEPBGA (27x27) | TDMoP | - | - | ||||||
|
Microsemi Corporation | TEMAP 84FDL GREEN DUAL PASSIVATI | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | HIGH DENSITY FRAMER/MAPPER FOR 8 | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - | ||||||
|
Microsemi Corporation | SINGLE-CHIP SONET/SDH TRANSPORT | - | - | - | - | - | - | Not For New Designs | - | - | - | - | - |