- Applied Filters :
37 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Type | Series | Length | Width | Material | Thickness | |
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Laird Technologies / Thermal Solutions | Thermal Interface Products TO-247, 0.750X1.0 H.140,T-gard 5000-A0 | Conductive Insulator | Tgard 5000 | 0.75 in | 1 in | Silicone Elastomer | 0.005 in | ||||
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Bergquist Company | Thermal Interface Products SILPAD 800 .005" 12X12" | Thermally Conductive Insulator | Sil-Pad 800 | 12 in | 12 in | 0.005 in | |||||
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Laird Technologies / Thermal Solutions | Thermal Interface Products TO-220, 0.5X0.75 H0.12,T-gard 5000-A0 | Conductive Insulator | Tgard 5000 | 0.5 in | 0.75 in | Silicone Elastomer | 0.005 in | ||||
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Bergquist Company | Thermal Interface Products Q-PAD PWR MOD .005 2.50x2.00 | Thermal Gap Filler Pad | Q-Pad 3 | 2.5 in | 2 in | Fiberglass | 0.005 in | ||||
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Laird Technologies / Thermal Solutions | Thermal Interface Products TO-3,2 PIN, 1.6X1.14 H.093 T-gard 5000-A0 | Conductive Insulator | Tgard 5000 | 1.6 in | 1.14 in | Silicone Elastomer | 0.005 in | ||||
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Laird Technologies / Thermal Solutions | Thermal Interface Products Tgon 805, A0 18" X 24" X 0.005" | Interface Pad | Tgon 800 | 18 in | 24 in | Graphite | 0.005 in | ||||
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Bergquist Company | Thermal Interface Products Q-PAD .005" .750x.500x.187x.147 | Thermal Gap Filler Pad | Q-Pad 3 | 0.75 in | 0.5 in | Fiberglass | 0.005 in | ||||
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Bergquist Company | Thermal Interface Products Q-PAD .005" .687x.562x.125 | Thermal Gap Filler Pad | Q-Pad 3 | 0.687 in | 0.562 in | Fiberglass | 0.005 in | ||||
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Bergquist Company | Thermal Interface Products SILPAD QPAD .005" 12X12" | Thermal Gap Filler Pad | Q-Pad 3 | 12 in | 12 in | 0.005 in | |||||
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Laird Technologies | Thermal Interface Products Tpcm 905c 18x18" 2.2 W/mK TIM | Conductive Phase Change Material | Tpcm 900 | Boron Nitride | 0.005 in | ||||||
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Bergquist Company | Thermal Interface Products Q-PAD RECT .005" 1.00x1.00x.187 | Thermal Gap Filler Pad | Q-Pad 3 | 1 in | 1 in | Fiberglass | 0.005 in | ||||
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Bergquist Company | Thermal Interface Products Q-PAD 4LEAD .005" 1.56x1.05x1.17 | Thermal Gap Filler Pad | Q-Pad 3 | 1.56 in | 1.05 in | Fiberglass | 0.005 in | ||||
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Bergquist Company | Thermal Interface Products Q-PAD PWR MOD .005 1.50x.90x1.20 | Thermal Gap Filler Pad | Q-Pad 3 | 1.5 in | 0.9 in | Fiberglass | 0.005 in | ||||
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Bergquist Company | Thermal Interface Products Q-PAD .005" .750x.500x.187x.125 | Thermal Gap Filler Pad | Q-Pad 3 | 0.75 in | 0.5 in | Fiberglass | 0.005 in | ||||
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Bergquist Company | Thermal Interface Products Q-PAD CLIP .005" .75x.500 | Thermal Gap Filler Pad | Q-Pad 3 | 0.75 in | 0.5 in | Fiberglass | 0.005 in | ||||
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Bergquist Company | Thermal Interface Products THERMAL PAD RECT .005" Q3 ADH | Thermal Gap Filler Pad | Q-Pad 3 | 0.005 in | |||||||
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Bergquist Company | Thermal Interface Products Q-PAD .005" 1.00x.75x.30x.14 | Thermal Gap Filler Pad | Q-Pad 3 | 1 in | 0.75 in | Fiberglass | 0.005 in | ||||
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Bergquist Company | Thermal Interface Products BONDPLY 800 .005" 12X12" | Conductive Adhesive Tape | 12 in | 12 in | 0.005 in | ||||||
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Laird Technologies / Thermal Solutions | Thermal Interface Products TO-230,0.500X0.75 NOHOL,T-gard 5000-A0 | Conductive Insulator | Tgard 5000 | 0.5 in | 0.75 in | Silicone Elastomer | 0.005 in | ||||
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Laird Technologies / Thermal Solutions | Thermal Interface Products TO-250,0.562X0.887 H0.125T-gard 3000-A0 | Conductive Insulator | Tgard 3000 | 0.562 in | 0.887 in | Silicone Elastomer | 0.005 in | ||||
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Laird Technologies / Thermal Solutions | Thermal Interface Products T-gard 5000-A0,TO-10 2 PIN,0.7X1.25 H.062 | Conductive Insulator | Tgard 5000 | 0.7 in | 1.25 in | Silicone Elastomer | 0.005 in | ||||
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Laird Technologies / Thermal Solutions | Thermal Interface Products T-gard 3000-A0,TO-10 2 PIN,0.7X1.25 H.062 | Conductive Insulator | Tgard 3000 | 0.7 in | 1.25 in | Silicone Elastomer | 0.005 in | ||||
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Laird Technologies / Thermal Solutions | Thermal Interface Products DO-5, D1.0,H0.260 T-gard 5000-A0 | Conductive Insulator | Tgard 5000 | 1 in | 1 in | Silicone Elastomer | 0.005 in | ||||
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Laird Technologies / Thermal Solutions | Thermal Interface Products TO-5 2 PIN,1.25X1.78 H0.14,T-gard 5000-A0 | Conductive Insulator | Tgard 5000 | 1.25 in | 1.78 in | Silicone Elastomer | 0.005 in | ||||
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Laird Technologies / Thermal Solutions | Thermal Interface Products T0-3,4 PIN,1.14X1.65 H0.08,T-gard 5000-A0 | Conductive Insulator | Tgard 5000 | 1.14 in | 1.65 in | Silicone Elastomer | 0.005 in | ||||
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Laird Technologies / Thermal Solutions | Thermal Interface Products SIP Mod,0.838X1.45 H0.17,T-gard 5000-A0 | Conductive Insulator | Tgard 5000 | 0.838 in | 1.45 in | Silicone Elastomer | 0.005 in | ||||
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Bergquist Company | Thermal Interface Products HI FLOW 650P .0050" 11X12" | Thermal Gap Filler Pad | 0.005 in | ||||||||
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Bergquist Company | Thermal Interface Products BOND-PLY 100 TAPE .005" 11x12" | Conductive Adhesive Tape | Bond-Ply 100 | 11 in | 12 in | Fiberglass | 0.005 in | ||||
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Laird Technologies | Thermal Interface Products Tpcm FSF52,05,A0 18" x 18" | Free Standing Film | Tpcm FSF-52 | 18 in | 18 in | Ceramic Filled Silicone | 0.005 in | ||||
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Laird Technologies / Thermal Solutions | Thermal Interface Products TO-250,0.562X0.887 H0.125T-gard 5000-A0 | Conductive Insulator | Tgard 5000 | 0.562 in | 0.887 in | Silicone Elastomer | 0.005 in |