- Package / Case :
- Operating Temperature :
- Supplier Device Package :
- Number of Logic Elements/Cells :
5 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Number of Gates | Mounting Type | Number of I/O | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
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Microsemi Corporation | IC FPGA 68 I/O 100VQFP | 100-TQFP | ProASIC3 | 250000 | Surface Mount | 207 | -55°C ~ 125°C (TJ) | Active | 1.425 V ~ 1.575 V | 100-VQFP (14x14) | - | - | 36864 | ||||
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Microsemi Corporation | IC FPGA 114 I/O 256FBGA | 256-LBGA | Fusion® | 250000 | Surface Mount | 207 | -40°C ~ 100°C (TJ) | Active | 1.425 V ~ 1.575 V | 256-FPBGA (17x17) | - | Export Control Classification Number (ECCN) Code | 36864 | ||||
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Microsemi Corporation | IC FPGA 114 I/O 256FBGA | 256-LBGA | Fusion® | 250000 | Surface Mount | 207 | -40°C ~ 100°C (TJ) | Active | 1.425 V ~ 1.575 V | 256-FPBGA (17x17) | - | 13824 | 36864 | ||||
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Microsemi Corporation | IC FPGA 157 I/O 256FBGA | 256-LBGA | Automotive, AEC-Q100, ProASIC3 | 250000 | Surface Mount | 207 | -40°C ~ 125°C (TA) | Active | 1.425 V ~ 1.575 V | 256-FPBGA (17x17) | - | 13824 | 36864 | ||||
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Microsemi Corporation | IC FPGA 157 I/O 256FBGA | 256-LBGA | Automotive, AEC-Q100, ProASIC3 | 250000 | Surface Mount | 207 | -40°C ~ 125°C (TA) | Active | 1.425 V ~ 1.575 V | 256-FPBGA (17x17) | - | Max Reverse Voltage (DC) | 36864 |