- Package / Case :
- Operating Temperature :
- Supplier Device Package :
4 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Number of Gates | Mounting Type | Number of I/O | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Number of LABs/CLBs | Total RAM Bits | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microsemi Corporation | IC FPGA 223 I/O 484FBGA | 484-BGA | Fusion® | 1500000 | Surface Mount | 344 | -55°C ~ 100°C (TJ) | Active | 1.425 V ~ 1.575 V | 484-FPBGA (23x23) | 18144 | 276480 | |||||
|
Microsemi Corporation | IC FPGA 223 I/O 484FBGA | 484-BGA | Fusion® | 1500000 | Surface Mount | 344 | -55°C ~ 100°C (TJ) | Active | 1.425 V ~ 1.575 V | 484-FPBGA (23x23) | 18144 | 276480 | |||||
|
Microsemi Corporation | IC FPGA 252 I/O 676FBGA | 676-BGA | Fusion® | 1500000 | Surface Mount | 344 | -40°C ~ 100°C (TJ) | Active | 1.425 V ~ 1.575 V | 676-FBGA (27x27) | - | 276480 | |||||
|
Microsemi Corporation | IC FPGA 252 I/O 676FBGA | 676-BGA | Fusion® | 1500000 | Surface Mount | 344 | -40°C ~ 100°C (TJ) | Active | 1.425 V ~ 1.575 V | 676-FBGA (27x27) | - | 276480 |