- Number of Gates :
- Total RAM Bits :
18 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Number of Gates | Mounting Type | Number of I/O | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Microsemi Corporation | IC FPGA 171 I/O 208CQFP | 208-BFCQFP with Tie Bar | SX-A | 108000 | Surface Mount | 223 | -55°C ~ 125°C (TC) | Active | 2.25 V ~ 5.25 V | 208-CQFP (75x75) | 2880 | - | - | ||||
|
|
|
Microsemi Corporation | IC FPGA MX SGL CHIP 54K 256-CQFP | 208-BFCQFP with Tie Bar | MX | 54000 | - | 223 | -55°C ~ 125°C (TJ) | Active | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | 208-CQFP (75x75) | 6036 | - | 2560 | ||||
|
|
Microsemi Corporation | IC FPGA 176 I/O 208CQFP | 208-BFCQFP with Tie Bar | MX | 54000 | Surface Mount | 223 | -55°C ~ 125°C (TJ) | Active | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | 208-CQFP (75x75) | 6036 | - | 2560 | ||||
|
|
Microsemi Corporation | IC FPGA 213 I/O 256CQFP | 256-BFCQFP with Tie Bar | SX-A | 108000 | Surface Mount | 223 | -55°C ~ 125°C (TC) | Active | 2.25 V ~ 5.25 V | 256-CQFP (75x75) | - | - | - | ||||
|
|
|
Microsemi Corporation | IC FPGA 176 I/O 208CQFP | 208-BFCQFP with Tie Bar | MX | 54000 | Surface Mount | 223 | -55°C ~ 125°C (TC) | Active | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | 208-CQFP (75x75) | - | - | 2560 | ||||
|
|
|
Microsemi Corporation | IC FPGA 158 I/O 208CQFP | 208-BFCQFP with Tie Bar | ProASICPLUS | 600000 | Surface Mount | 223 | -55°C ~ 125°C (TC) | Active | 2.3 V ~ 2.7 V | 208-CQFP (75x75) | - | - | 129024 | ||||
|
|
Microsemi Corporation | IC FPGA 69 I/O 84CQFP | 84-CQFP Exposed Pad and Tie Bar | SX-A | 48000 | Surface Mount | 223 | -55°C ~ 125°C (TC) | Active | 2.25 V ~ 5.25 V | 84-CQFP (42x42) | - | 481000 | - | ||||
|
|
Microsemi Corporation | IC FPGA 642 I/O 896FBGA | 896-BGA | ProASICPLUS | 1000000 | Surface Mount | 223 | -55°C ~ 125°C (TC) | Active | 2.3 V ~ 2.7 V | 896-FBGA (31x31) | 8064 | - | 202752 | ||||
|
|
|
Microsemi Corporation | IC FPGA 95 I/O 132CPGA | - | MX | 14000 | Surface Mount | 223 | -55°C ~ 125°C (TJ) | Active | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | 132-CPGA | 8064 | - | - | ||||
|
|
|
Microsemi Corporation | IC FPGA 158 I/O 208QFP | 208-BFQFP | ProASICPLUS | 1000000 | Surface Mount | 223 | -55°C ~ 125°C (TC) | Active | 2.3 V ~ 2.7 V | 208-PQFP (28x28) | - | - | 202752 | ||||
|
|
|
Microsemi Corporation | IC FPGA 69 I/O 84CQFP | 84-CQFP Exposed Pad and Tie Bar | SX-A | 48000 | Surface Mount | 223 | 0°C ~ 70°C (TA) | Active | 2.25 V ~ 5.25 V | 84-CQFP (42x42) | - | - | - | ||||
|
|
|
Microsemi Corporation | IC FPGA 388 I/O | - | PolarFire™ | - | - | 223 | 0°C ~ 100°C (TJ) | Active | 0.97 V ~ 1.08 V | - | - | - | 33792000 | ||||
|
|
|
Microsemi Corporation | IC FPGA 388 I/O | - | PolarFire™ | - | - | 223 | 0°C ~ 100°C (TJ) | Active | 0.97 V ~ 1.08 V | - | - | - | 33792000 | ||||
|
|
|
Microsemi Corporation | IC FPGA 252 I/O 676FBGA | 676-BGA | Fusion® | 1500000 | Surface Mount | 223 | -40°C ~ 100°C (TJ) | Active | 1.425 V ~ 1.575 V | 676-FBGA (27x27) | - | - | 276480 | ||||
|
|
Microsemi Corporation | IC FPGA 317 I/O 484FBGA | 484-BGA | Axcelerator | 1000000 | Surface Mount | 223 | 0°C ~ 70°C (TA) | Active | 1.425 V ~ 1.575 V | 484-FPBGA (23x23) | - | - | 165888 | ||||
|
|
|
Microsemi Corporation | IC FPGA 317 I/O 484FBGA | 484-BGA | Axcelerator | 1000000 | Surface Mount | 223 | 0°C ~ 70°C (TA) | Active | 1.425 V ~ 1.575 V | 484-FPBGA (23x23) | - | - | 165888 | ||||
|
|
Microsemi Corporation | IC FPGA 72 I/O 84PLCC | 84-LCC (J-Lead) | MX | 24000 | Surface Mount | 223 | -55°C ~ 125°C (TC) | Active | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | 84-PLCC (29.31x29.31) | - | - | - | ||||
|
|
|
Microsemi Corporation | IC FPGA 186 I/O 256FBGA | 256-LBGA | ProASICPLUS | 600000 | Surface Mount | 223 | -40°C ~ 125°C (TJ) | Active | 2.375 V ~ 2.625 V | 256-FPBGA (17x17) | - | - | 129024 |