- Manufacture :
- Packaging :
- Output Type :
- Accuracy :
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- Supplier Device Package :
- Sensing Temperature :
45 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Output Type | Function | Topology | Mounting Type | Accuracy | Sensor Type | Part Status | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | Sensing Temperature | Output Alarm | Output Fan | |
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NXP USA Inc. | IC TEMPERATURE SENSOR DDR 8HWSON | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor) | ADC (Sigma Delta), Register Bank | Surface Mount | ±4°C(Max) | Internal | Obsolete | 1.7 V ~ 3.6 V | 8-HWSON (2x3) | 0 | 4000 | -40°C ~ 125°C | Yes | Yes | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 3V 8-DFN | 8-VFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 2.7 V ~ 5.5 V | 8-DFN (2x3) | 0 | 0 | -40°C ~ 125°C | Yes | No | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 3V 8-TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Obsolete | 3 V ~ 3.6 V | 8-TDFN (2x3) | 0 | 11000 | -40°C ~ 125°C | Yes | Yes | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 3V 8-TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 3 V ~ 3.6 V | 8-TDFN (2x3) | 0 | 0 | -40°C ~ 125°C | Yes | Yes | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 3V 8-DFN | 8-VFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 3 V ~ 3.6 V | 8-DFN (2x3) | 0 | 0 | -40°C ~ 125°C | Yes | Yes | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 3V 8-DFN | 8-VFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | - | Internal | Active | 3 V ~ 3.6 V | 8-DFN (2x3) | 0 | 0 | -40°C ~ 125°C | Yes | Yes | ||||
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NXP USA Inc. | IC TEMP SENSOR DDR 3.6V 8-HXSON | 8-XFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor) | ADC (Sigma Delta), Register Bank | Surface Mount | ±4°C(Max) | Internal | Obsolete | 1.7 V ~ 3.6 V | 8-HXSON (2x3) | 0 | 4000 | -40°C ~ 125°C | Yes | Yes | ||||
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NXP USA Inc. | IC TEMP SENSOR DDR 8-TSSOP | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor) | ADC (Sigma Delta), Register Bank | Surface Mount | ±4°C(Max) | Internal | Obsolete | 1.7 V ~ 3.6 V | 8-TSSOP | 0 | 2500 | -40°C ~ 125°C | Yes | Yes | ||||
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Microchip Technology | IC MEMORY MOD TEMP SENSOR 8-DFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Obsolete | 3 V ~ 3.6 V | 8-TDFN (2x3) | 0 | 3300 | -40°C ~ 125°C | Yes | Yes | ||||
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2,765
In-stock
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Microchip Technology | IC MEMORY MOD TEMP SENSOR 8-DFN | 8-VFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Obsolete | 3 V ~ 3.6 V | 8-DFN (2x3) | 0 | 3300 | -40°C ~ 125°C | Yes | Yes | |||
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Microchip Technology | IC TEMP SENSOR 2WIRE 8-TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor) | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 3 V ~ 3.6 V | 8-TDFN (2x3) | 0 | 0 | -40°C ~ 125°C | No | Yes | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 8-UDFN | 8-UFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Obsolete | 3 V ~ 3.6 V | 8-UDFN (2x3) | 0 | 3300 | -40°C ~ 125°C | Yes | Yes | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 8-TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 3 V ~ 3.6 V | 8-TDFN (2x3) | 0 | 0 | -40°C ~ 125°C | Yes | Yes | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 8-DFN | 8-VFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 3 V ~ 3.6 V | 8-DFN (2x3) | 0 | 0 | -40°C ~ 125°C | Yes | Yes | ||||
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STMicroelectronics | IC MEMORY MOD TEMP SENSOR 8-TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor) | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Obsolete | 2.7 V ~ 3.6 V | 8-TDFN (2x3) | 0 | 3000 | -40°C ~ 125°C | Yes | No | ||||
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STMicroelectronics | IC TEMP SENSOR 2KB EEPRM 8-TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor) | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Obsolete | 2.7 V ~ 3.6 V | 8-TDFN (2x3) | 0 | 3000 | -40°C ~ 125°C | Yes | No | ||||
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Microchip Technology | IC MEMORY MOD TEMP SENSOR 8TSSOP | 8-TSSOP (0.173", 4.40mm Width) | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Obsolete | 3 V ~ 3.6 V | 8-TSSOP | 0 | 2500 | -40°C ~ 125°C | Yes | Yes | ||||
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Microchip Technology | IC MEMORY MOD TEMP SENSOR 8TSSOP | 8-TSSOP (0.173", 4.40mm Width) | - | Tube | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Obsolete | 3 V ~ 3.6 V | 8-TSSOP | 0 | -40°C ~ 125°C | Yes | Yes | |||||
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NXP USA Inc. | IC TEMP SENSOR I2C 8HVSON | 8-VFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor) | ADC (Sigma Delta), Register Bank | Surface Mount | ±4°C(Max) | Internal | Obsolete | 1.7 V ~ 3.6 V | 8-HVSON (3x3) | 0 | 6000 | -40°C ~ 125°C | Yes | Yes | ||||
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NXP USA Inc. | IC TEMP SENSOR I2C 8TSSOP | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor) | ADC (Sigma Delta), Register Bank | Surface Mount | ±4°C(Max) | Internal | Obsolete | 1.7 V ~ 3.6 V | 8-TSSOP | 0 | 2500 | -40°C ~ 125°C | Yes | Yes | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 3V 8-UDFN | 8-UFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 2.7 V ~ 5.5 V | 8-UDFN (2x3) | 0 | 11000 | -40°C ~ 125°C | Yes | No | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 3V 8-UDFN | 8-UFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 2.7 V ~ 5.5 V | 8-UDFN (2x3) | 0 | 3300 | -40°C ~ 125°C | Yes | No | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 3V 8-TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 2.7 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 4000 | -40°C ~ 125°C | Yes | No | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 3V 8-TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 2.7 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 11000 | -40°C ~ 125°C | Yes | No | ||||
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Microchip Technology | IC TEMP SENSOR 2WIRE 3V 8-DFN | 8-VFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3% | Internal | Active | 2.7 V ~ 5.5 V | 8-DFN (2x3) | 0 | 11000 | -40°C ~ 125°C | Yes | No | ||||
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Microchip Technology | IC DIMM TEMP SENSOR 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | 2-Wire Serial, I²C | Temp Monitoring System (Sensor) | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 1.7 V ~ 3.6 V | 8-TDFN (2x3) | 0 | 11000 | -40°C ~ 125°C | Yes | Yes | ||||
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Microchip Technology | IC DIMM TEMP SENSOR 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | 2-Wire Serial, I²C | Temp Monitoring System (Sensor) | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 1.7 V ~ 3.6 V | 8-TDFN (2x3) | 0 | 4000 | -40°C ~ 125°C | Yes | Yes | ||||
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Microchip Technology | IC TEMP SENSOR DGTL 8-TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor) | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 2.7 V ~ 5.5 V | 8-TDFN (2x3) | 0 | 3300 | -40°C ~ 125°C | Yes | No | ||||
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Microchip Technology | IC SENSOR THERMAL 3.0V 8DFN | 8-VFDFN Exposed Pad | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor) | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 3 V ~ 3.6 V | 8-DFN (2x3) | 0 | 3300 | -40°C ~ 125°C | No | Yes | ||||
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7,123
In-stock
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Microchip Technology | IC TEMP SENSOR 2WIRE 3V 8-TSSOP | 8-TSSOP (0.173", 4.40mm Width) | - | Tape & Reel (TR) | I²C/SMBus | Temp Monitoring System (Sensor), DIMM DDR Memory | ADC (Sigma Delta), Register Bank | Surface Mount | ±3°C(Max) | Internal | Active | 2.7 V ~ 5.5 V | 8-TSSOP | 0 | 2500 | -40°C ~ 125°C | Yes | No |