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89 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Mounting Type | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Applications | Current - Supply | Factory Stock | Minimum Quantity | |
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NXP USA Inc. | SBC 3V 1CAN 0LIN 6SG HLQFP48 | - | - | Tape & Reel (TR) | - | -40°C ~ 125°C | Obsolete | 3.5 V ~ 28 V | 48-LQFP (7x7) | System Basis Chip | 7mA | 0 | 0 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
|
5,147
In-stock
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NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
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NXP USA Inc. | SBC, DCDC 1.5A VCORE FS1B CAN,15 | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
|
NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP, LINEAR 0.5A V | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
|
NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
|
NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP LINEAR 0.5A V | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
|
6,518
In-stock
|
NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
|
NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
|
NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
|
7,610
In-stock
|
NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
|
NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
|
NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
|
3,504
In-stock
|
NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
|
2,083
In-stock
|
NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
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NXP USA Inc. | FS4500 | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
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4,658
In-stock
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NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | ||||
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NXP USA Inc. | SYSTEM BASIS CHIP LINEAR 0.5A V | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
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NXP USA Inc. | SYSTEM BASIS CHIP LINEAR 0.5A V | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
|
NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 | |||||
|
NXP USA Inc. | FS4500 | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | - | 0 | 2000 |