- Packaging :
83 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Mounting Type | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Applications | Current - Supply | Factory Stock | Minimum Quantity | |
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NXP USA Inc. | IC PWR MGMT IMX50/53 130MAPBGA | 130-LFBGA | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 3 V ~ 4.5 V | 130-MAPBGA (8x8) | Processor | 370µA | 0 | |||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tray | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 260 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tray | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 260 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tray | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 260 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tray | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 260 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tray | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 260 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tray | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 260 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 4000 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 4000 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 4000 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 4000 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 4000 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 4000 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 4000 | ||||
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NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 4000 | ||||
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NXP USA Inc. | IC PWR MGMT I.MX7 6LDO QFN 48 | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | Processor | - | 0 | 4000 | ||||
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2,159
In-stock
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Maxim Integrated | IC POWER MGMT XSCALE 48WQFN | 40-WFQFN Exposed Pad | Automotive, AEC-Q100 | Tube | Surface Mount | -40°C ~ 85°C | Active | 2.6 V ~ 6 V | 40-TQFN-EP (5x5) | Processor | - | 1260 | ||||
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Texas Instruments | IC PWR MGMT FOR PROCESSORS | 169-LFBGA | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 3.135 ~ 5.25 V | 169-NFBGA (12x12) | Processor | - | 0 | |||||
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Texas Instruments | POWER MANAGEMENT IC (PMIC) FOR A | 169-LFBGA | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 3.135 ~ 5.25 V | 169-NFBGA (12x12) | Processor | - | 0 | |||||
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Texas Instruments | PMU FOR PROCESSOR | - | - | - | - | -40°C ~ 85°C | Active | 3.135 ~ 5.25 V | - | Processor | - | 0 | |||||
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7,667
In-stock
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Maxim Integrated | IC POWER MGMT XSCALE 48WQFN | 40-WFQFN Exposed Pad | Automotive, AEC-Q100 | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.6 V ~ 6 V | 40-TQFN-EP (5x5) | Processor | - | 10000 | 2500 | |||
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Maxim Integrated | IC PMIC HI EFF LOW IQ 48-TQFN | 48-WFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.6 V ~ 5.5 V | 48-TQFN-EP (6x6) | Processor | - | 0 | 2500 | ||||
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3,594
In-stock
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Maxim Integrated | IC POWER MANAGE XSCALE 40-TQFN | 40-WFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.6 V ~ 6 V | 40-TQFN-EP (5x5) | Processor | - | 0 | 2500 | |||
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4,965
In-stock
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Maxim Integrated | IC POWER MANAGE XSCALE 40-TQFN | 40-WFQFN Exposed Pad | - | Tube | Surface Mount | -40°C ~ 85°C | Active | 2.6 V ~ 6 V | 40-TQFN-EP (5x5) | Processor | - | 0 | 120 | |||
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Texas Instruments | TPS659127YFFT | - | - | - | - | -40°C ~ 85°C | Active | 1.8 V ~ 5.5 V | - | Processor | 32µA | 0 | |||||
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Texas Instruments | IC PMU MGMT 81DSBGA | 81-UFBGA, DSBGA | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 1.8 V ~ 5.5 V | 81-DSBGA (3.6x3.6) | Processor | 32µA | 0 | |||||
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3,785
In-stock
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Maxim Integrated | IC POWER MANAGE XSCALE 40-TQFN | 40-WFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.6 V ~ 6 V | 40-TQFN-EP (5x5) | Processor | - | 0 | 2500 | |||
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Texas Instruments | IC PMU FOR APP PROCESSOR 40WQFN | 40-WFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.7 V ~ 5.5 V | 40-WQFN (5x5) | Processor | 60µA | 5000 | |||||
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Texas Instruments | IC PMU FOR ADV APPLICATION 40QFN | 40-WFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.7 V ~ 5.5 V | 40-WQFN (5x5) | Processor | 60µA | 0 | |||||
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Texas Instruments | IC PMU FOR APP PROCESSOR 40WQFN | 40-WFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.7 V ~ 5.5 V | 40-WQFN (5x5) | Processor | 60µA | 0 |