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16 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Mounting Type | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Applications | Current - Supply | Factory Stock | Minimum Quantity | |
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NXP USA Inc. | IC REG 9OUT BUCK/LDO 56QFN | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tray | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | |||||
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NXP USA Inc. | IC REG 9OUT BUCK/LDO 56QFN | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tray | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | |||||
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NXP USA Inc. | REGULATOR BUCK QUAD WITH UP TO | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tray | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | |||||
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NXP USA Inc. | REGULATOR BUCK QUAD WITH UP TO | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tray | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | |||||
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NXP USA Inc. | REGULATOR BUCK QUAD WITH UP TO | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tray | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | |||||
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NXP USA Inc. | REGULATOR BUCK QUAD WITH UP TO | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tray | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | |||||
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Packet Digital LLC | IC PWM SATA CONTROL 56QFN | 56-VFQFN Exposed Pad | On-Demand Power® | Tray | Surface Mount | 0°C ~ 70°C | Active | 6.5 V ~ 24 V | 56-QFN-EP (8x8) | Handheld/Mobile Devices | 3mA | 0 | |||||
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IDT, Integrated Device Technology Inc | IC WIRELESS PWR TX | 56-VFQFN Exposed Pad | - | Tray | Surface Mount | -40°C ~ 85°C | Not For New Designs | 4.5 V ~ 6.9 V | 56-VFQFPN (7x7) | Wireless Power Transmitter | - | 12220 | |||||
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NXP USA Inc. | PF4210 | 56-VFQFN Exposed Pad | - | Tray | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | Audio, Video | - | 0 | |||||
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NXP USA Inc. | PF4210 | 56-VFQFN Exposed Pad | - | Tray | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | Audio, Video | - | 0 | |||||
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NXP USA Inc. | PF4210 | 56-VFQFN Exposed Pad | - | Tray | Surface Mount | 0°C ~ 85°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | Audio, Video | - | 0 | |||||
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NXP USA Inc. | PF4210 | 56-VFQFN Exposed Pad | - | Tray | Surface Mount | 0°C ~ 85°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | Audio, Video | - | 0 | |||||
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NXP USA Inc. | IC REG 9OUT BUCK/LDO 56QFN | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tray | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | |||||
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Microchip Technology | IC ULTRASOUND DRIVER 56VQFN | 56-VFQFN Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C | Active | 2.37 V ~ 3.47 V | 56-QFN (8x8) | Pulse Generator | - | 0 | |||||
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NXP USA Inc. | IC REG 9OUT BUCK/LDO 56QFN | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tray | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | |||||
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Microchip Technology | IC ULTRASOUND DRIVER 56VQFN | 56-VFQFN Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C | Active | -60 V ~ 60 V | 56-QFN (8x8) | Pulse Generator | 1A | 0 |