- Package / Case :
- Supplier Device Package :
4 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Number of Gates | Mounting Type | Number of I/O | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Number of LABs/CLBs | Number of Logic Elements/Cells | |
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Microsemi Corporation | IC FPGA 175 I/O 208CQFP | 208-BFCQFP with Tie Bar | SX | 24000 | Surface Mount | 175 | -55°C ~ 125°C (TJ) | Obsolete | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 208-CQFP (75x75) | Tongue Thickness | - | ||||
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Microsemi Corporation | IC FPGA 175 I/O 208CQFP | 208-BFCQFP with Tie Bar | SX | 24000 | Surface Mount | 175 | -55°C ~ 125°C (TJ) | Obsolete | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 208-CQFP (75x75) | Tongue Thickness | - | ||||
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Microsemi Corporation | IC FPGA 180 I/O 256CQFP | 256-BFCQFP Exposed Pad and Tie Bar | SX | 24000 | Surface Mount | 180 | -55°C ~ 125°C (TJ) | Obsolete | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 256-CQFP (75x75) | Tongue Thickness | - | ||||
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Microsemi Corporation | IC FPGA 180 I/O 256CQFP | 256-BFCQFP Exposed Pad and Tie Bar | SX | 24000 | Surface Mount | 180 | -55°C ~ 125°C (TJ) | Obsolete | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 256-CQFP (75x75) | Tongue Thickness | - |