- Package / Case :
- Operating Temperature :
104 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Mounting Type | Number of I/O | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | - | IGLOO2 | - | 267 | -55°C ~ 125°C (TJ) | Active | 1.14 V ~ 2.625 V | - | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | 484-BGA | IGLOO2 | Surface Mount | 267 | -55°C ~ 125°C (TJ) | Active | 1.14 V ~ 2.625 V | 484-FPBGA (23x23) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | - | IGLOO2 | - | 267 | -55°C ~ 125°C (TJ) | Active | 1.14 V ~ 2.625 V | - | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | 484-BGA | IGLOO2 | Surface Mount | 267 | -55°C ~ 125°C (TJ) | Active | 1.14 V ~ 2.625 V | 484-FPBGA (23x23) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | - | Automotive, AEC-Q100, IGLOO2 | - | 267 | -40°C ~ 135°C (TJ) | Active | 1.14 V ~ 2.625 V | - | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 387 I/O 676FBGA | 676-BGA | Automotive, AEC-Q100, IGLOO2 | Surface Mount | 387 | -40°C ~ 125°C (TJ) | Active | 1.14 V ~ 2.625 V | 676-FBGA (27x27) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | - | Automotive, AEC-Q100, IGLOO2 | - | 267 | -40°C ~ 125°C (TJ) | Active | 1.14 V ~ 2.625 V | - | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 207 I/O 400VFBGA | - | Automotive, AEC-Q100, IGLOO2 | - | 207 | -40°C ~ 125°C (TJ) | Active | 1.14 V ~ 2.625 V | - | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 387 I/O 676FBGA | 676-BGA | IGLOO2 | Surface Mount | 387 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 676-FBGA (27x27) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 387 I/O 676FBGA | 676-BGA | IGLOO2 | Surface Mount | 387 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 676-FBGA (27x27) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | 484-BGA | IGLOO2 | Surface Mount | 267 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 484-FBGA (23x23) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | 484-BGA | IGLOO2 | Surface Mount | 267 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 484-FPBGA (23x23) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 207 I/O 400VFBGA | 400-LFBGA | IGLOO2 | Surface Mount | 207 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 400-VFBGA (17x17) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 207 I/O 400VFBGA | 400-LFBGA | IGLOO2 | Surface Mount | 207 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 400-VFBGA (17x17) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 387 I/O 676FBGA | 676-BGA | IGLOO2 | Surface Mount | 387 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 676-FBGA (27x27) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 387 I/O 676FBGA | 676-BGA | IGLOO2 | Surface Mount | 387 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 676-FBGA (27x27) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 387 I/O 676FBGA | 676-BGA | IGLOO2 | Surface Mount | 387 | 0°C ~ 85°C (TJ) | Active | 1.14 V ~ 2.625 V | 676-FBGA (27x27) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 387 I/O 676FBGA | 676-BGA | IGLOO2 | Surface Mount | 387 | 0°C ~ 85°C (TJ) | Active | 1.14 V ~ 2.625 V | 676-FBGA (27x27) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 387 I/O 676FBGA | 676-BGA | IGLOO2 | Surface Mount | 387 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 676-FBGA (27x27) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 387 I/O 676FBGA | 676-BGA | IGLOO2 | Surface Mount | 387 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 676-FBGA (27x27) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | 484-BGA | IGLOO2 | Surface Mount | 267 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 484-FBGA (23x23) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | 484-BGA | IGLOO2 | Surface Mount | 267 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 484-FPBGA (23x23) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | 484-BGA | IGLOO2 | Surface Mount | 267 | 0°C ~ 85°C (TJ) | Active | 1.14 V ~ 2.625 V | 484-FBGA (23x23) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | 484-BGA | IGLOO2 | Surface Mount | 267 | 0°C ~ 85°C (TJ) | Active | 1.14 V ~ 2.625 V | 484-FPBGA (23x23) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | 484-BGA | IGLOO2 | Surface Mount | 267 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 484-FBGA (23x23) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | 484-BGA | IGLOO2 | Surface Mount | 267 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 484-FPBGA (23x23) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 387 I/O 676FBGA | 676-BGA | IGLOO2 | Surface Mount | 387 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 676-FBGA (27x27) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 387 I/O 676FBGA | 676-BGA | IGLOO2 | Surface Mount | 387 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 676-FBGA (27x27) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | 484-BGA | IGLOO2 | Surface Mount | 267 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 484-FBGA (23x23) | - | Body Plating | 1869824 | |||||
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Microsemi Corporation | IC FPGA 267 I/O 484FBGA | 484-BGA | IGLOO2 | Surface Mount | 267 | -40°C ~ 100°C (TJ) | Active | 1.14 V ~ 2.625 V | 484-FPBGA (23x23) | - | Body Plating | 1869824 |