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33 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Number of Gates | Mounting Type | Number of I/O | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
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Intel | IC FPGA 364 I/O 780FBGA | 780-BBGA, FCBGA | Government Qualified | - | Surface Mount | 364 | -40°C ~ 100°C (TJ) | Active | 0.87 V ~ 0.93 V | 780-FBGA (29x29) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | 572-PIN FBGA | 572-BGA, FCBGA | Government Qualified | - | Surface Mount | 252 | -40°C ~ 100°C (TJ) | Active | 0.87 V ~ 0.93 V | 572-FBGA, FC (25x25) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 364 I/O 780FBGA | 780-BBGA, FCBGA | Government Qualified | - | Surface Mount | 364 | -40°C ~ 100°C (TJ) | Active | 0.87 V ~ 0.93 V | 780-FBGA (29x29) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 364 I/O 780FBGA | 780-BBGA, FCBGA | Government Qualified | - | Surface Mount | 364 | -40°C ~ 100°C (TJ) | Active | 0.87 V ~ 0.93 V | 780-FBGA (29x29) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 364 I/O 780FBGA | 780-BBGA, FCBGA | Government Qualified | - | Surface Mount | 364 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 780-FBGA (29x29) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 252 I/O 572FBGA | 572-BGA, FCBGA | Government Qualified | - | Surface Mount | 252 | -40°C ~ 100°C (TJ) | Active | 0.87 V ~ 0.93 V | 572-FBGA, FC (25x25) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 364 I/O 780FBGA | 780-BBGA, FCBGA | Government Qualified | - | Surface Mount | 364 | -40°C ~ 100°C (TJ) | Active | 0.87 V ~ 0.93 V | 780-FBGA (29x29) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 364 I/O 780FBGA | 780-BBGA, FCBGA | Government Qualified | - | Surface Mount | 364 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 780-FBGA (29x29) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 252 I/O 572FBGA | 572-BGA, FCBGA | Government Qualified | - | Surface Mount | 252 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 572-FBGA, FC (25x25) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 252 I/O 572FBGA | 572-BGA, FCBGA | Government Qualified | - | Surface Mount | 252 | -40°C ~ 100°C (TJ) | Active | 0.87 V ~ 0.93 V | 572-FBGA, FC (25x25) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 252 I/O 572FBGA | 572-BGA, FCBGA | Government Qualified | - | Surface Mount | 252 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 572-FBGA, FC (25x25) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 156 I/O 358UBGA | 358-LFBGA, FCBGA | Government Qualified | - | Surface Mount | 156 | -40°C ~ 100°C (TJ) | Active | 0.87 V ~ 0.93 V | 358-UBGA, FC (17x17) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 364 I/O 780FBGA | 780-BBGA, FCBGA | Government Qualified | - | Surface Mount | 364 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 780-FBGA (29x29) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 364 I/O 780FBGA | 780-BBGA, FCBGA | Government Qualified | - | Surface Mount | 364 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 780-FBGA (29x29) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 156 I/O 358UBGA | 358-LFBGA, FCBGA | Government Qualified | - | Surface Mount | 156 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 358-UBGA, FC (17x17) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 156 I/O 358UBGA | 358-LFBGA, FCBGA | Government Qualified | - | Surface Mount | 156 | -40°C ~ 100°C (TJ) | Active | 0.87 V ~ 0.93 V | 358-UBGA, FC (17x17) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 156 I/O 358UBGA | 358-LFBGA, FCBGA | Government Qualified | - | Surface Mount | 156 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 358-UBGA, FC (17x17) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 252 I/O 572FBGA | 572-BGA, FCBGA | Government Qualified | - | Surface Mount | 252 | -40°C ~ 100°C (TJ) | Active | 0.87 V ~ 0.93 V | 572-FBGA, FC (25x25) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 252 I/O 572FBGA | 572-BGA, FCBGA | Government Qualified | - | Surface Mount | 252 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 572-FBGA, FC (25x25) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 156 I/O 358UBGA | 358-LFBGA, FCBGA | Government Qualified | - | Surface Mount | 156 | -40°C ~ 100°C (TJ) | Active | 0.87 V ~ 0.93 V | 358-UBGA, FC (17x17) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 156 I/O 358UBGA | 358-LFBGA, FCBGA | Government Qualified | - | Surface Mount | 156 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 358-UBGA, FC (17x17) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 252 I/O 572FBGA | 572-BGA, FCBGA | Government Qualified | - | Surface Mount | 252 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 572-FBGA, FC (25x25) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 156 I/O 358UBGA | 358-LFBGA, FCBGA | Government Qualified | - | Surface Mount | 156 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 358-UBGA, FC (17x17) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 364 I/O 780FBGA | 780-BBGA, FCBGA | Government Qualified | - | Surface Mount | 364 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 780-FBGA (29x29) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 364 I/O 780FBGA | 780-BBGA, FCBGA | Government Qualified | - | Surface Mount | 364 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 780-FBGA (29x29) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 252 I/O 572FBGA | 572-BGA, FCBGA | Government Qualified | - | Surface Mount | 252 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 572-FBGA, FC (25x25) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 156 I/O 358UBGA | 358-LFBGA, FCBGA | Government Qualified | - | Surface Mount | 156 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 358-UBGA, FC (17x17) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 252 I/O 572FBGA | 572-BGA, FCBGA | Government Qualified | - | Surface Mount | 252 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 572-FBGA, FC (25x25) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 156 I/O 358UBGA | 358-LFBGA, FCBGA | Government Qualified | - | Surface Mount | 156 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 358-UBGA, FC (17x17) | Current - Output 1 | Plating Thickness | 5371904 | ||||
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Intel | IC FPGA 156 I/O 358UBGA | 358-LFBGA, FCBGA | Government Qualified | - | Surface Mount | 156 | 0°C ~ 85°C (TJ) | Active | 0.87 V ~ 0.93 V | 358-UBGA, FC (17x17) | Current - Output 1 | Plating Thickness | 5371904 |