- Package / Case :
- Supplier Device Package :
- Interface :
9 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Number of Circuits | Function | Mounting Type | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Interface | Current - Supply | Power (Watts) | |
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Maxim Integrated | IC TDM/PACKET TRANSPORT 676BGA | 676-BGA | - | Tray | TDM-over-Packet (TDMoP) | Surface Mount | -40°C ~ 85°C | Discontinued at Digi-Key | 1.8V, 3.3V | 676-TEPBGA (27x27) | TDMoP | - | - | |||||
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IDT, Integrated Device Technology Inc | IC LIU T1/J1/E1 16+1CH 416BGA | 416-BGA | - | Tray | Line Interface Unit (LIU) | Surface Mount | -40°C ~ 85°C | Obsolete | 1.8V, 3.3V | 416-PBGA (27x27) | E1, J1, T1 | - | - | |||||
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IDT, Integrated Device Technology Inc | IC LINE INTERFACE UNIT 416BGA | 416-BGA | - | Tray | Line Interface Unit (LIU) | Surface Mount | -40°C ~ 85°C | Obsolete | 1.8V, 3.3V | 416-PBGA (27x27) | E1, J1, T1 | - | - | |||||
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Infineon Technologies | IC LIU E1/T1/J1 80MQFP | 80-QFP | FALC™ | Tray | Framer, Line Interface Unit (LIU) | Surface Mount | -40°C ~ 85°C | Obsolete | 1.8V, 3.3V | P-MQFP-80-1 | E1, HDLC, J1, T1 | 80mA | 250mW | |||||
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Infineon Technologies | IC LIU E1/T1/J1 81LBGA | 81-LBGA | FALC™ | Tray | Framer, Line Interface Unit (LIU) | Surface Mount | -40°C ~ 85°C | Obsolete | 1.8V, 3.3V | P-LBGA-81 | E1, HDLC, J1, T1 | 80mA | 250mW | |||||
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Maxim Integrated | IC TDM PACKET 32PORT 676PBGA | 676-BGA | - | Tray | TDM-over-Packet (TDMoP) | Surface Mount | -40°C ~ 85°C | Not For New Designs | 1.8V, 3.3V | 676-TEPBGA (27x27) | TDMoP | - | - | |||||
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IDT, Integrated Device Technology Inc | IC LIU T1/J1/E1 21+1CH 640BGA | 640-BGA Exposed Pad | - | Tray | Line Interface Unit (LIU) | Surface Mount | -40°C ~ 85°C | Active | 1.8V, 3.3V | 640-TEPBGA (31x31) | E1, J1, T1 | - | - | |||||
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IDT, Integrated Device Technology Inc | IC LINE INTERFACE UNIT 640BGA | 640-BGA Exposed Pad | - | Tray | Line Interface Unit (LIU) | Surface Mount | -40°C ~ 85°C | Active | 1.8V, 3.3V | 640-TEPBGA (31x31) | E1, J1, T1 | - | - | |||||
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Maxim Integrated | IC TDM OVER PACKET 676-BGA | 676-BGA | - | Tray | TDM-over-Packet (TDMoP) | Surface Mount | -40°C ~ 85°C | Active | 1.8V, 3.3V | 676-TEPBGA (27x27) | TDMoP | - | - |