- Packaging :
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15 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Input Type | Number of Drivers | Mounting Type | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Factory Stock | Minimum Quantity | Channel Type | Driven Configuration | Gate Type | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | Rise / Fall Time (Typ) | |
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Microchip Technology | IC MOSFET DVR 1.5A DUAL 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Inverting, Non-Inverting | Surface Mount | -40°C ~ 150°C (TJ) | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | 3300 | Independent | Low-Side | N-Channel, P-Channel MOSFET | 0.8V, 2V | 1.5A, 1.5A | 11.5ns, 10ns | |||||
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Microchip Technology | IC MOSFET DVR 1.5A DUAL 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Inverting | Surface Mount | -40°C ~ 150°C (TJ) | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | 3300 | Independent | Low-Side | N-Channel, P-Channel MOSFET | 0.8V, 2V | 1.5A, 1.5A | 11.5ns, 10ns | |||||
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Microchip Technology | IC MOSFET DVR 1.5A DUAL 8TDFN | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Inverting | Surface Mount | -40°C ~ 150°C (TJ) | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | 3300 | Independent | Low-Side | N-Channel, P-Channel MOSFET | 0.8V, 2V | 1.5A, 1.5A | 11.5ns, 10ns | |||||
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Microchip Technology | 4.5A MATCHED, HIGH -SPEED, LOW-S | 8-WFDFN Exposed Pad | - | Tube | Inverting, Non-Inverting | Surface Mount | -40°C ~ 125°C (TA) | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | Single | Low-Side | IGBT | 0.8V, 2V | 4.5A, 4.5A | 12ns, 12ns | ||||||
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Microchip Technology | 4.5A MATCHED, HIGH -SPEED, LOW-S | 8-WFDFN Exposed Pad | - | Tube | Non-Inverting | Surface Mount | -40°C ~ 125°C (TA) | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | Single | Low-Side | IGBT | 0.8V, 2V | 4.5A, 4.5A | 12ns, 12ns | ||||||
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Microchip Technology | 4.5A MATCHED, HIGH -SPEED, LOW-S | 8-WFDFN Exposed Pad | - | Tube | Inverting | Surface Mount | -40°C ~ 125°C (TA) | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | Single | Low-Side | IGBT | 0.8V, 2V | 4.5A, 4.5A | 12ns, 12ns | ||||||
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Microchip Technology | 4.5A MATCHED, HIGH -SPEED, LOW-S | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Inverting, Non-Inverting | Surface Mount | -40°C ~ 125°C (TA) | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | 3300 | Single | Low-Side | IGBT | 0.8V, 2V | 4.5A, 4.5A | 12ns, 12ns | |||||
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Microchip Technology | 4.5A MATCHED, HIGH -SPEED, LOW-S | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Inverting | Surface Mount | -40°C ~ 125°C (TA) | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | 3300 | Single | Low-Side | IGBT | 0.8V, 2V | 4.5A, 4.5A | 12ns, 12ns | |||||
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Microchip Technology | 4.5A MATCHED, HIGH -SPEED, LOW-S | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Inverting | Surface Mount | -40°C ~ 125°C (TA) | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | 3300 | Single | Low-Side | IGBT | 0.8V, 2V | 4.5A, 4.5A | 12ns, 12ns | |||||
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Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | 8-WFDFN Exposed Pad | - | - | Inverting, Non-Inverting | Surface Mount | -40°C ~ 125°C | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | Independent | High-Side | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | ||||||
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Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | 8-WFDFN Exposed Pad | - | - | Non-Inverting | Surface Mount | -40°C ~ 125°C | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | Independent | High-Side | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | ||||||
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Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | 8-WFDFN Exposed Pad | - | - | Inverting | Surface Mount | -40°C ~ 125°C | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | Independent | High-Side | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | ||||||
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Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Inverting, Non-Inverting | Surface Mount | -40°C ~ 125°C | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | 3300 | Independent | High-Side | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | |||||
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Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Non-Inverting | Surface Mount | -40°C ~ 125°C | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | 3300 | Independent | High-Side | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | |||||
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Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | 8-WFDFN Exposed Pad | - | Tape & Reel (TR) | Inverting | Surface Mount | -40°C ~ 125°C | Active | 4.5 V ~ 18 V | 8-TDFN (2x3) | 0 | 3300 | Independent | High-Side | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns |