- Manufacture :
- Package / Case :
- Function :
- Supplier Device Package :
- Interface :
4 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Packaging | Number of Circuits | Function | Mounting Type | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Interface | |
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Microsemi Corporation | TEMUX-84 WITH E3 MAPPERS, DS3/E3 | 324-FBGA | - | - | Framer | Surface Mount | -40°C ~ 85°C | Not For New Designs | 1.8V, 3.3V | 324-PBGA (23x23) | E1, J1, T1 | ||||
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Microsemi Corporation | TEMUX-84 WITH E3 MAPPERS, DS3/E3 | 324-FBGA | - | - | Framer | Surface Mount | -40°C ~ 85°C | Not For New Designs | 1.8V, 3.3V | 324-PBGA (23x23) | E1, J1, T1 | ||||
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Maxim Integrated | IC TDM PACKET 32PORT 676PBGA | 676-BGA | Tray | TDM-over-Packet (TDMoP) | Surface Mount | -40°C ~ 85°C | Not For New Designs | 1.8V, 3.3V | 676-TEPBGA (27x27) | TDMoP | |||||
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Microsemi Corporation | FOUR CHANNEL COMBINED T1/E1/J1 T | 256-BGA | - | Transceiver | Surface Mount | -40°C ~ 85°C | Not For New Designs | 1.8V, 3.3V | 256-CABGA (17x17) | E1, J1, SPI, T1 |